High Frequency Measuring Instrument
High Frequency Measuring Instrument
Description:
For ultrasonic components measuring instrument, the most important is the admittance chart, logarithmic graph of the two graphics (the two graphics is the main method of qualified qualified), and more than a dozen parameters: resonance frequency Fs, the maximum conductance Gmax, bandwidth F2-F1, anti-resonance frequency Fp, quality factor Qm, free capacitance CT, dynamic resistance R1, dynamic inductance L1, dynamic capacitance C1, static capacitance C0, effective electromechanical coupling coefficient Keff.
Specification:
| Impedance Analyzer | HS520A Newest |
| Frequency Range | 1KHz~500KHz/1Mhz/3Mhz |
| Basic Accuracy | < 0.5% |
| Scan Speed | 5 sec/one pass (equivalent to 600 scan dots) |
| Frequency Accuracy | ±10 ppm |
| Phase Accuracy | 0.15 degree |
| Temperature Range | 10~40 degree Celsius |
| Impedance Range | 0.1Ω~1MΩ |
| Frequency Step | 0.1Hz to Any |
| Measure Items | Resonance Frequency: Fs |
| Half Power Frequency: F1 and F2 | |
| Maximum real admittance at Fs: Gmax | |
| Dynamic Resistance: R1 | |
| Anti resonance frequency: Fp | |
| Mechanical quality factor: Qm | |
| Free capacitance: CT | |
| Dynamic inductance: L1 | |
| Dynamic capacitance: C1 | |
| Static capacitance: Co | |
| electromechanical coupling coefficient: Keff and Kp | |
| Maximum real impedance at Fp: Zmax | |
| Measure Diagram | G,B-F |
| G-B (admittance circle coordinate) | |
| R,X-F | |
| R-X (impedance circle coordinate) | |
| Z,phase-F | |
| Y,phase-F | |
| Z(Logarithm),phase-F | |
| Amplification | piezoelectric ceramic, ultrasonic transducer, power ultrasonic, ultrasonic weld, ultrasonic clean, ultrasonic sensor |
Dimensions : 240mm*190mm*100mm Size of LCD Screen: 8-inch screen |
Applications:
Ultrasonic Component Analyzer HS520A series of products for various types of ultrasonic devices for measuring objects, including: piezoelectric ceramics, transducers, ultrasonic cleaning machines, ultrasonic plastic welding machine, underwater acoustic, magnetostrictive materials, ultrasonic grinder, ultrasonic atomization , Ultrasonic cleaning, reversing radar, ultrasonic ranging, phacoemulsification, ultrasonic cleaning, ultrasonic motors, and all other devices and devices used in piezoelectric and ultrasound.
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